PCB fast-prototyping service

As a Chinese hardware engineer, it is painful for me to wait one or two months for the PCB prototypes to be produced and assembled. And it really prevent us from product iterations in PCB.

The question is why it takes so long to manufacture several pieces of PCB but developing a software just take few days?

The answer is simple: it is like playing music with a band when we talk about software, but for the hardware, it is like coordinating an orchestra. It is true for all the manufactures around the word.

 

band

U2–Software dev

orchestra

Orchestra–Hardware dev


 

 

Don’t worry, the hard-working Chinese people have solved all this by offering PCB fast-prototyping services.

Just send them BOM, GEBER  and NC DRILL files.

A four layer PCB with all the components assembled comes to us just in two weeks. And the quality is ensured by their testing facilities!

 

TWO WEEKS!!

Take a look at their capability:

Standard PCB Specification

Features Capability
Layers 1-32 layers
Material FR4 standard Tg 140C, FR4 high Tg 170C
Board Thickness .016″-.126″(0.4mm-3.2mm)
Copper Thickness 1/2oz-6oz(18um-210um)
Inner layer Copper Thickness 0.5oz-2oz(18um-70um)
Board size 600x700mm
Min Tracing/Spacing 3mil/3mil
Min Annular Ring 3mil
Min drilling Hole diameter 0.15mm(6mil), 0.1mm(4mil)-laser drill
Min width of cutout (NPTH) 0.8mm
Min width of slot hole (PTH) 0.6mm
Solder Mask LPI, different colors(Green, Green matt, Black, Black Matt, White, Red, Yellow, Blue)
Silkscreen color White, Blue, Black, Red, Yellow
Surface finish HASL -Hot Air Solder Leveling
Lead Free HASL – RoHS
ENIG -Electroless Nickle/Immersion Gold – RoHS(Thick of Au 1-3 u”)
ENIG -Electroless Nickle/Immersion Gold – RoHS(Thick of Au 3-5 u”)
ENIG -Electroless Nickle/Immersion Gold – RoHS(Thick of Au >5 u”)Immersion Silver – RoHS
Immersion Tin – RoHS
OSP -Organic Solderability Preservatives – RoHS
Surface/Hole plating thickness 20-30um
Board thickness tolerance +/-0.1mm ~ +/-10%
Board size tolerance +/-0.1mm~+/-0.3mm
PTH hole size tolerance +/-.003″(+/-0.08mm)~+/-.006″(+/-0.15mm)
NPTH hole size tolerance +/-.002″(+/-0.05mm)
Copper thickness tolerance +0um+20um
SM tolerance(LPI) .003″(0.075mm)
Impedance tolerance +/-5%~+/-10%
SMD Pitch 0.2mm(8mil)
BGA Pitch 0.2mm(8mil)
Aspect Ratio(hole size: board thickness) 1:10
Chamfer of Gold Fingers 20, 30, 45, 60
Test 10V-250V, flying probe or testing fixture
Others Techniques Gold fingers
Blind/Buried hole
peelable solder mask
Edge plating
Carbon Mask
Kapton tape
Countersink/counterbore hole
Half-cutted/Castellated hole
Press fit hole
Via tented/covered with resin
Via plugged/filled with resin
Via in pad

 

121212 1212121212

 

 

Our board is in test equipment.

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